SOLICITATION NOTICE
A -- REPACKAGE THE HARDWARE IN THE ARMY'S MULTI-OPTION FUZE ARTILLERY
- Notice Date
- 1/24/2003
- Notice Type
- Solicitation Notice
- Contracting Office
- N00178 NAVSURFWARCEN Dahlgren Division 17320 Dahlgren Road Dahlgren, VA
- ZIP Code
- 00000
- Solicitation Number
- N0017803Q1013
- Archive Date
- 2/27/2003
- Point of Contact
- XDS115 (540)653-7478 ATTN XDS115 FAX (540)653-7088
- E-Mail Address
-
Email your questions to XDS115 is the POC for N00178-03-Q-1013
(xds11@nswc.navy.mil)
- Description
- This requirement will be negotiated solely with Electronics Development Corporation (EDC), 9055F Guilford Road, Columbia, Maryland 21046, the designer. The effort includes repackaging of the proximity sensor in the multi-optic fuze, artillery (MOFA). The following tasks are needed to provide the appropriate support to the program: A. MOFA Proximity Sensor Design Support, i. Provide system and circuit support to assist in selecting specific implementation, schematic, and hardware for integration of the design into the overall system; ii. Provide input for and objective review of particular sections of the height of burst interface control document (HOB ICD), as appropriate. In particular, adequate information to define the pin interfaces for both the monolithic microwave integrated circuit (MMIC) and the directional Doppler ratio (DDR) signal processor ASIC (application speci fic integrated circuit) is required. B. Guidance Integrated Fuzing (GIF) Hardware Support (Repackaging), i.Layout/procure multi-layer PWBs. The Demo effort requires repackaging of the entire HOB circuitry to a more space efficient design. The design and test effort will require PWBs for all-up subsystem testing and for chip-specific testing. 1. All-Up Subsystem. Repackaging requirements dictate use of significantly different components from that allotted for current MOFA implementation. Efforts will include help with optimizing component layout to minimize development costs while operating within design constraint space bounded by component specs (e.g., 10 percent vs. 1 percent resistor tolerances), number of board layers, and overall footprint of subassembly; 2. Chip-Specific. Shock testing of the repackaged ASIC chip design may require a simple yet unique board for moun ting in the airgun and verifying chip package survival across shock. Parallel activities to meet overall program schedule may dictate design of a simple, 1 or 2 layer board for testing the repackaged chip independent of the overall subsystem repackaged design. Help with the layout and procurement of this design may be required. ii. Procure parts. Total quantities for this Demo effort will be 12: 2 items for potential gun shot integration, 5 items for shock testing (i.e., airgun), and 5 items for lab testing. 1. MMIC / Antenna subassemblies. Existing MOFA MMICS and antennae are baselined. A total of 17 items will be required: 12 items acquired for integration / testing and an additional 5 items acquired for backup. 2. DDR ASICs. Ongoing investigations are exploring opportunities to use the current MOFA ASIC (unmodified HDL-103) and / or possibly repackaging the associa ted die into a more efficient package. Required support to include providing existing chips, acquiring unpackaged dies, and investigating alternative packaging schemes from traditional and non-traditional chip packaging houses. We will ultimately require 12 items for integration, but an additional 10 items for non-integrated environmental testing and backup is required. 3. Additional support items (resistors, capacitors, etc.) will be required to fully develop the HOB circuits. As appropriate, acquisition of these items to meet schedule will be required. iii. Assemble PWBs. All up assemblies. 12 all-up assemblies are required for HOB subsystem environmental shock testing and performance characterization. C. Component Testing. i. All up Assemblies. 12 all-up assemblies are required for HOB subsystem environmental shock testing and performance characterization. ii. Additi onal PWBs for environmental testing of the repackaged ASIC (if appropriate) will be required. The additional boards will be appropriately designed to verify integrity of repackaged chip. D. MOFA Proximity Sensor Test Support. i. Test Plan Development. Provide input to and objective review of an overall test plan for the PWB. ii. Verify Performance. Provide data and/or MOFA hardware for comparison purposes. Comparison of the performance of the PWB and MMIC/Antenna assembly to the MOFA assembly is required. Values to be compared include, but are not limited to, bandwidth, center frequency, and power output of the MMIC/Antenna assembly and I/O waveforms/response of the ASIC located on the PWB. iii. Testing Facility. As required, provide facilities to perform performance testing of the repackaged proximity sensor (PWB and MMIC/Antenna assembly). This may require developmen t of an interface for the PWB. Testing that may be required includes radio frequency (RF) Range Simulation and board level testing of the PWB. iv. Environmental testing. Principal environmental testing will be gun shock survivability assessment of any repackaged components and subassemblies. Support may include assisting with board layout, procurement, and/or population. Additional support will include assistance with pre- and post-test characterization of test items. This effort must be complete by 30 September 2003. Interested parties other than EDC must be able to demonstrate in writing by 28 January 2003, their capability to provide the requested services. Please reference the RFQ Number N00178-03-Q-1013 when forwarding your requested information. The mailing address is Attn: XDS115, Naval Surface Warfare Center, Dahlgren Division, 17320 Dahlgren Road, Dahlgren, VA 2 2448-5100, email XDS11@nswc.navy.mil; or fax number is (540)653-7088.
- Web Link
-
NSWCDD Dahlgren Laboratory Supply Division Web Site
(http://www.nswc.navy.mil/supply)
- Record
- SN00246585-W 20030126/030124214556 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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