SPECIAL NOTICE
A -- LAWRENCE LIVERMORE NATIONAL LABORATORY SEEKS LICENSEE TO PRODUCE AND SELL HEATSINKS FOR INTEGRATED CIRCUITS USING MICROCHANNEL COOLING
- Notice Date
- 2/3/2004
- Notice Type
- Special Notice
- Contracting Office
- Department of Energy, Lawrence Livermore National Laboratory (DOE Contractor), Industrial Partnerships & Commercialization, 7000 East Avenue L-795, Livermore, CA, 94550
- ZIP Code
- 94550
- Solicitation Number
- Reference-Number-FBO66-04
- Response Due
- 3/5/2004
- Archive Date
- 3/8/2004
- Point of Contact
- Connie Pitcock, Administration, Phone 925-422-1072, Fax 925-423-8988,
- E-Mail Address
-
pitcock1@llnl.gov
- Description
- LAWRENCE LIVERMORE NATIONAL LABORATORY SEEKS LICENSEE TO PRODUCE AND SELL HEATSINKS FOR INTEGRATED CIRCUITS USING MICROCHANNEL COOLING Announcement: Lawrence Livermore National Laboratory (LLNL), operated by the University of California under contract with the U.S. Department of Energy (DOE), wants to license the technology to produce heatsinks for integrated circuits (especially microprocessors) using microchannel cooling. LLNL has proven microchannel technology for providing aggressive cooling for semiconductor devices. LLNL currently uses microchannel cooling to produce high performance water-cooled laser diode packages. However, LLNL believes this same technology would prove effective in providing air-cooling for integrated circuits, such as microprocessors. LLNL has an issued patent (#5,099,311 et.al.) which broadly covers the use of microchannel cooling as a means of cooling. LLNL initially developed this technology to cool integrated circuits for ?Star Wars? projects in the 90s. Before developing this technology, LLNL analyzed the various methods of cooling and determined that microchannel cooling provided the best possible cooling versus other possible methods of cooling (A doctoral thesis on this subject is available). The proven microchannel technology at LLNL uses heatsinks made of silicon. Etching processes long perfected by the semiconductor industry permits fabrication of precision microchannels in the silicon heatsinks which lie in close proximity to the integrated circuit being cooled. The resulting architecture minimizes most elements of the thermal resistance of the system to provide extremely effective cooling in a compact design. LLNL believes this technology is now timely for commercialization because of the current problems in cooling integrated circuits, particularly microprocessors. Note: THIS IS NOT A PROCUREMENT. Companies interested in commercializing LLNL's microchannel cooling for integrated circuits should provide a written statement of interest, which includes the following: 1. Company Name and address. 2. The name, address, and telephone number of a point of contact. 3. A description of corporate expertise and facilities relevant to commercializing this technology. Written responses should be directed to: Lawrence Livermore National Laboratory Industrial Partnerships and Commercialization P.O. Box 808, L-795 Livermore, CA 94551-0808 Attention: FBO 66-04 Please provide your written statement within thirty (30) days from the date this announcement is published to ensure consideration of your interest in LLNL's microchannel cooling for integrated circuits.
- Record
- SN00514766-W 20040205/040203211915 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
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