SOLICITATION NOTICE
A -- Miniaturized Interchangeable Communications Kit (MICK) Board Layout and Packaging - Supporting Documents
- Notice Date
- 5/18/2010
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 541330
— Engineering Services
- Contracting Office
- Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
- ZIP Code
- 95652
- Solicitation Number
- H94003-10-Q-1024
- Archive Date
- 6/22/2010
- Point of Contact
- Jeanne M. Woodcock, Phone: 9162311510, Mary L. Lawrence, Phone: 9162311526
- E-Mail Address
-
woodcock@dmea.osd.mil, lawrence@dmea.osd.mil
(woodcock@dmea.osd.mil, lawrence@dmea.osd.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- MICK Bill of Materials MICK Prototype Schematics DD Forms 1423-2, Contract Data Requirements List Statement of Work 10-0F0 This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. The Request for Quotation (RFQ) H94003-10-Q-1024 is issued as a 100% Total Small Business Set-Aside. The applicable North American Industry Classification System (NAICS) code is 541330, Engineering Services. The small business size standard is $4.5M. This solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-41 (13 May 2010). The intent of this solicitation is to procure manufacturing services for the layout, fabrication, assembly, packaging, and testing of a Miniaturized Interchangeable Communications Kit (MICK) currently being developed by the Defense Microelectronics Activity (DMEA) as detailed in the attached Statement of Work, DMEA SOW 10-0F0. The objective of the project is to develop a microelectronics design that will ultimately be miniaturized and housed in an enclosure that can withstand specific environmental conditions. This task requires the contractor to provide circuit board layout, fabrication, & assembly capabilities, and the capability to design a custom enclosure to house the circuit cards and connectors. The contractor shall design the method to mount the circuit cards within the enclosure. The design of the MICK unit includes cable design/assembly, in addition to the inclusion of an external battery and an existing Iridium board module provided by DMEA. The MICK will be developed in three phases: 1) Prototype Phase (PP), 2) Initial Miniaturization Phase (IMP), 3) Final Miniaturization Phase (FMP). This solicitation will result in a firm fixed-price contract containing the following contract line item number(s): 0001 Prototype Phase Delivery (5 functional boards) tiny_mce_marker_________ 0002 Initial Miniaturization Phase Delivery (5 functional boards) tiny_mce_marker_________ 0003 Final Miniaturization Phase, Enclosure Design, and MICK Assembly Delivery (10 functional assemblies and 2 functional boards without the enclosure) tiny_mce_marker_________ 0004 Program Management and Design Data NOT SEPARATELY PRICED The following attachments are included and applicable to this solicitation: (1) DMEA Statement of Work (SOW) 10-0F0, with Appendix A (9 pages) (2) DD Forms 1423-2, Contract Data Requirements List (4 pages) (3) MICK Prototype Schematics (5 pages) (4) Bill of Materials (BOM) (3 pages) The period of performance for this task will be six (6) months from date of award. All deliverables will be FOB destination to Defense Microelectronics Activity, 4234 54th Street, McClellan, CA 95652-2100. SOLICITATION PROVISIONS/CONTRACT CLAUSES: The following FAR provisions and clauses apply to this solicitation and are incorporated by reference: FAR 52.204-7 Central Contractor Registration; FAR 52.212-1 Instructions to Offerors - Commercial Items (Jun 2008). FAR 52.212-2 Evaluation - Commercial Items (Jan 1999) AMENDED as follows: 52.212-2 ADDENDUM - EVALUATION-COMMERCIAL ITEMS (a) The government will award a contract, resulting from this solicitation, to the responsible offeror whose offer, conforming to the solicitation, will be most advantageous to the government, price and other factors considered. The following factors shall be used to evaluate offers: (1) Technical Capability (2) Past Performance (3) Schedule (4) Price Technical capability, past performance, and schedule (in descending order of importance) will first be evaluated for acceptability on a pass/fail basis. Offers passing the pass/fail acceptability for factors 1, 2, and 3 will then proceed to a best value Lowest Price Technically Acceptable (LPTA) source selection process where technical capability, past performance, and schedule are significantly more important than price when being evaluated. In addition to a price proposal, a written technical proposal shall be provided that does not exceed 10 pages (excluding letters of endorsement), which discusses the following criteria. (b) Technical Capability: (1) The technical evaluation process will evaluate the offeror's qualifications to perform the requirements stated in the SOW 10-0F0 (Attachment 1 of this solicitation). Technical capability will be evaluated based on the sub-factors listed below. Each sub-factor will be rated on a pass/fail basis. If any subfactor results in an unacceptable (failed) rating, it will render the entire technical final rating as unacceptable (failed). Only those offers determined to be technically acceptable (pass), either initially or as a result of clarifications, will proceed to the LPTA evaluation process. Subfactor 1 - PCB Layout Design/Miniaturization and Enclosure Design. The government will evaluate the offeror's expertise/capability with PCB layout design/miniaturization and enclosure design. The offeror's proposal shall include a concise description of their technical expertise and capability with PCB layout design/miniaturization and enclosure design. In addition, applicants shall briefly describe their expertise and capability in verification and test methods Subfactor 2 - System Integration and Assembly. The government will evaluate the offeror's expertise/capability with system integration of electronics into an enclosure, assembly, and test. The offeror's proposal shall include a concise description of their technical expertise and capability with system integration of electronics into an enclosure, assembly, and test. Subfactor 3 - Technical Staff Experience and Expertise. The government will evaluate the offeror's experience and demonstrated expertise related to PCB layout design and miniaturization, enclosure design, and system integration. The offeror's proposal shall include a concise description of expertise and current experience within the past 3 years related to PCB layout design and miniaturization, enclosure design, and system integration. Provide a brief paragraph for key personnel on related skills and experience; resumes are not required. (c) Past Performance - The government will evaluate the offeror's performance on similar work performed within the past three years. The offeror's proposal shall include letters of endorsement from previous clients (commercial or government) describing work done for past projects within the past 3 years related to PCB layout design and miniaturization, enclosure design, and system integration. (d) Schedule - The government will evaluate the offeror's proposed project schedule based on completion of all phases of the work within a performance period of 6 months from award of contract. The proposal should include a detailed schedule of tasks for all phases of work. (e) Price - Technically acceptable offers will proceed to a proposed price evaluation. Price will be evaluated to determine the offeror's understanding of the contract requirements as expressed by the solicitation. The offeror's price proposal should include a firm-fixed price broken out by CLIN, for CLINs 0001, 0002, and 0003. CLIN 0004 will not be separately priced; all costs for data should be included as applicable in the prices for CLINs 0001-0003. (g) The government intends to award a contract without discussions with respective offerors. The government, however, reserves the right to conduct discussions if deemed in its best interest. (End of Provision) FAR 52.212-3 Offeror Representations and Certifications -- Commercial Items (Aug 2009): The FAR requires the use of the Online Representations and Certifications Application (ORCA) in Federal solicitations as a part of the proposal submission process to satisfy FAR 52.212-3. More information on ORCA is found at https://orca.bpn.gov/login.aspx. FAR 52.212-4 Contract Terms and Conditions -- Commercial Items (Mar 2009). FAR 52.212-5 Contract Terms and Conditions Required To Implement Statutes Or Executive Orders -- Commercial Items (Apr 2010) For the purposes of this clause items (b) 8, 18, 19, 21, 22, 24, 33, 38 and (c)1 are considered checked and apply. DFARS 52.212-7001 Contract Terms and Conditions Required To Implement Statutes Or Executive Orders Applicable to Defense Acquisition of Commercial Items (Apr 2010) For the purposes of this clause items (b) 1,5, 17,18,19, and 23 are considered checked and apply. The Defense Priorities and Allocation System (DPAS) rating is DO-S10. The date, time and place offers are due: 06/07/2010, 3:00pm Pacific time to :DMEA, Contracting Office, 4234 54th Street, McClellan, CA 95652-2100. Emailed offers are encouraged: email woodcock@dmea.osd.mil and Lawrence@dmea.osd.mil.
- Web Link
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(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-10-Q-1024/listing.html)
- Record
- SN02153054-W 20100520/100518235326-948d9580cffd8fb660f61646837c7419 (fbodaily.com)
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