PRESOL | A | Bumpdeposition on ROC wafers

FBO DAILY ISSUE OF OCTOBER 23, 2010 FBO #3255
SOLICITATION NOTICE

A -- Bumpdeposition on ROC wafers

Notice Date: 10/21/2010
Notice Type: Presolicitation
NAICS: 334413 — Semiconductor and Related Device Manufacturing
Contracting Office: Department of Energy, SLAC National Accelerator Lab, SLAC National Accelerator Lab, 2575 Sand Hill Road, Menlo Park, California, 94303, United States
ZIP Code: 94303
Solicitation Number: SLAC159274
Point of Contact: Julie M. Greer, Phone: 6509264165
E-Mail Address: greer@slac.stanford.edu
(greer@slac.stanford.edu)
Small Business Set-Aside: N/A
Description: 1.lot of 63 modules, solder Bumpdeposition on ROC and sensor wafers Bumpdeposition on ROC wafer, deposition of solderable pixel padson sensor wafer and flip chip assembly of 60 double chip senoor. Sensor wafers sensor cips provided.
Web Link: FBO.gov Permalink
(https://www.fbo.gov/spg/DOE/SLAC/STAN/SLAC159274/listing.html)
Place of Performance: Address: 2575 Sand Hill Rd, Menlo Park, California, 94025, United States; Zip Code: 94025
Record: SN02314974-W 20101023/101021234243-2700c1da6271cfbc53e6e3df530a20e4 (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

| FSG Index | This Issue's Index | Today's FBO Daily Index Page |