SOURCES SOUGHT
66 -- Flip Chip Bonder
- Notice Date
- 2/6/2012
- Notice Type
- Sources Sought
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640
- ZIP Code
- 20899-1640
- Solicitation Number
- AMD-12-SS11
- Archive Date
- 3/7/2012
- Point of Contact
- Paula Wilkison, Phone: 301-975-8448, PatrickStaines, Phone: (301)975-6335
- E-Mail Address
-
paula.wilkison@nist.gov, patrick.staines@nist.gov
(paula.wilkison@nist.gov, patrick.staines@nist.gov)
- Small Business Set-Aside
- N/A
- Description
- The National Institute of Standards & Technology (NIST) seeks information on commercial vendors that are capable of providing a flip chip bonder. The CNST NanoFab is a state-of-the-art nanofabrication laboratory, and the flip chip bonder will be used to bond various types of chips (semiconductor and others), place solder preforms, dispense solder pastes, onto various types of substrates, such as semiconductor packages and wafers. The flip chip bonder shall be a table-top model with a camera-based vision and display system that can offer, at a minimum, the following bonding technologies: soldering (such as eutectic solders, indium), thermo-sonic, ultra-sonic, and adhesive (epoxies). Thermo-compression and under-fill capabilities are desirable. The tool will be sited in a multi-user facility where ease of use, intuitive software, fast and easy conversion from one technology to another and ruggedness are of paramount importance. After results of this market research are obtained and analyzed and specifications are developed for a flip chip bonder that can meet NIST's minimum requirements, NIST may conduct a competitive procurement and subsequently award a Purchase Order. If at least two qualified small businesses are identified during this market research stage, then any competitive procurement that resulted would be conducted as a small business set-aside. NIST has a need for a Flip Chip Bonder that would meet the following requirements: • Heated stage up to 450°C • Heated chip pick-up tool • Post-bond positioning accuracy +/- 1 micrometer • Positioning accuracy in X, Y and Z: 1 micrometer • Theta (rotation) accuracy: 0.25 degrees • Die size: 70 x 70 µm to 35 x 35 mm • Substrate size: up to 100 mm-diameter wafer • Vacuum or clamp substrate capture • Z-travel: minimum 10 mm • Shall accept dual-in line opto-electronics packages • Inert gas and formic acid delivery option • Bond force range: 10 to 2000 gram typical • Soft touch-down • Field of view (typical): zoom-adjustable from 0.4 x 0.4 mm to 5 x 5 mm • Color CCD camera with vertical viewing • Alignment vision system via beam splitter and image overlay • Programmable bond cycles including force, time, temperatures, power, gas flow NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 334516, as those domestic sources having 500 employees or less. Please include your company's size classification in any response to this notice. Companies that manufacture such flip chip bonders are requested to email a detailed report describing their capabilities to paula.wilkison@nist.gov no later than the response date for this sources sought notice. The following information is requested to be provided as part of the response to this sources sought notice: 1. Name of the company that manufactures the system components for which specifications are provided. 2. Name of company(ies) that are authorized to sell the system components, their addresses, and a point of contact for the company (name, phone number, fax number and email address). 3. Indication of number of days, after receipt of order that is typical for delivery of such systems. 4. Indication of whether each instrument for which specifications are sent to paula.wilkison@nist.gov are currently on one or more GSA Federal Supply Schedule contracts and, if so, the GSA FSS contract number(s). 5. Any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research. Point of Contact Paula Wilkison, Contract Specialist, Phone (301) 975-8448, Email paula.wilkison@nist.gov
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/AMD-12-SS11/listing.html)
- Place of Performance
- Address: 100 BUREAU DRIVE, MS 1640, GAITHERSBURG, Maryland, 20899, United States
- Zip Code: 20899
- Zip Code: 20899
- Record
- SN02668313-W 20120208/120206234343-7fb470fa7795b12e37fc4db588326f0e (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's FBO Daily Index Page |