Loren Data's SAM Daily™

fbodaily.com
Home Today's SAM Search Archives Numbered Notes CBD Archives Subscribe
FBO DAILY ISSUE OF AUGUST 16, 2012 FBO #3918
SOLICITATION NOTICE

99 -- Advanced Wafer Probers

Notice Date
8/14/2012
 
Notice Type
Combined Synopsis/Solicitation
 
NAICS
333295 — Semiconductor Machinery Manufacturing
 
Contracting Office
Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
 
ZIP Code
95652
 
Solicitation Number
H94003-12-R-0015
 
Archive Date
9/13/2012
 
Point of Contact
Lucy Boswell, Phone: 9162312824
 
E-Mail Address
lucy.boswell@dmea.osd.mil
(lucy.boswell@dmea.osd.mil)
 
Small Business Set-Aside
N/A
 
Description
K = Combined Synopsis/Solicitation Notice Classification: H966 NAICS Code: 333295 Title: Advanced Wafer Probers This is a combined synopsis/solicitation for commercial items in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. This requirement is competed as full and open. This Defense Microelectronics Activity (DMEA) Request for Proposal (RFP) announcement constitutes the solicitation; proposals are being requested and a written solicitation will not be issued. The N AICS code is 333295 and the size standard for this requirement is 500 employees. The RFP reference number is H94003-12-R-0015. DPAS rating is C9. Offerors proposals shall be valid for a minimum of 60 days. Offerors proposals are to be emailed to Lucy.boswell@dmea.osd.mil by 9:00 am (PT) Aug 29, 2012. Defense Microelectronics Activity (DMEA) is currently operating a Micromanipulator 8860 wafer prober and two (2) Wentworth MP2300 wafer probers. These wafer probers are no longer supported and are fraught with hardware problems and outdated software. The purpose of this combined synopsis/solicitation is to acquire three (3) wafer probers; one (1) primary wafer prober and two (2) optional wafer probers to meet the wafer testing requirements IAW Statement of Work (SOW) DMEA 12-2C5. The wafer probers will be used for: Primary; Wafer Level Reliability Testing, Option 1; Functional Testing with full mil-temp. Option 2; Functional Testing at ambient. The purchase order (PO) will have four (4) separately priced line items/requirements: Contract Line Item (CLIN) 0001 - Wafer Level Reliability Sation IAW SOW 12-2C5 ; CLIN 0002- Calibration for CLIN 0001 for One(1) year (after installation & IAW SOW 12-2C5); CLIN 0003-Option 1: Semi_Automatic Functional Probe Station with Thermal Chuck IAW SOW 12-2C5; CLIN 0004- Option 2: Semi-Automatic Functional Probe Station with Ambient Chuck IAW SOW 12-2C5. Proposals shall be submitted IAW the above CLIN structure. Proposals shall be submitted IAW the above CLIN structure and shall include Company name and address, Cage Code, DUNS Number, shipping and delivery, and point of contact name, number, and email. To request a copy of the SOW and documents email lucy.boswell@dmea.osd.mil and include company name, cage code and POC information. The Government intends to award a best value, Firm Fixed Price contract. Technical and past performance are more important than price. Offerors shall submit a required price proposal, written technical criteria and past performance references in 12 pt font and no more than 25 pages, by 9:00 a.m. Pacific Time, August 29 2012. An offer will be deemed unacceptable if it does not represent a reasonable effort to address the essential requirements of the solicitation, or if it clearly demonstrates that the offeror does not understand the requirements of the solicitation. The following factors shall be used to evaluate offers: Technical Criteria: Proposals will be evaluated based on the following criteria listed below. These are listed in their relative order of importance. Contractor shall demonstrate they can meet the requirements by answering the following statements / questions: •1. How does your proposed WLR system provide for continuous pin contact while the chuck is changing temperature as part of an automatic test program? Describe in detail the software/hardware accessories that provide this capability. •2. How would your proposed WLR system provide complete multi sub-site testing on all die over the whole wafer with multiple temperature requirements? Can your system support this type of testing without a technician's attendance over a long weekend test program? •3. How does your system prevent icing when probing below the dew point? Is the wafer maintained in a controlled atmosphere at all times? •4. To insure proper pin placement, describe the mechanisms your probe stations utilize to compensate for thermal expansion/contraction of the platen and chuck. •5. What maintenance procedures are required to keep the thermal chuck within electrical specification? •6. If the chiller is not used for extended periods of time, what are the recommended maintenance procedures? Attach a copy of the procedure from your Technical Manual and describe the fluid(s) used in your system. •7. Describe your method(s) for theta adjustment? Is it automatic? •8. Describe your method for automated 2 point alignment? •9. Does your systems edge sensor circuitry introduce any electrical noise on the chuck surface? How is this sensor isolated from the wafer? •10. Can your systems automatically adjust scope Z position to maintain focus on the wafer during a test program covering all die on the wafer.? •11. Does your system(s) have auto calibration capabilities? Describe. •12. Describe how software updates are provided and managed for your proposed system. •13. DMEA utilizes 2 separate software test environments: National Instruments LabVIEW and Keithley Instruments KITE (Keithley Interactive Test Environment). Describe how your proposed system(s) utilize both of these test environments to provide remote control of the wafer probe stations. Past Performance: The Government will collect and evaluate the information provided by references or through other means to assign a risk assessment. The Government may contact references other than those identified by the offeror and use that information in the past performance evaluation. If the offeror does not have any past performance information, the offeror will be given a neutral rating and will not be evaluated favorably or unfavorably for this criterion. The Contractor shall document its past performance on previous similar contracts. •14. The contractor shall provide references to at least 3 other customers (including company name, point of contact, address, phone number, and email) for whom similar work has been accomplished. References to current and active contracts are acceptable. •15. Contractor shall demonstrate how they provided qualified individuals within required timeframes to fill the requirements of similar contracts. •16. The contractor shall provide evidence that they have been in business for at least three years providing the types of services requested under this SOW. Price: Proposals will be evaluated for realism, completeness, reasonableness, and a total evaluate price to the Government will be calculated. This RFQ solicitation and incorporated provisions and clauses are those in effect and current to FAR Federal Acquisition Circular (Fac) 205-60. The following FAR and DFARS Clauses apply: 52.211-15, Defense Priority and Allocation Requirements; 52.212-1, Instructions to Offerors--Commercial Items; 52.212-3 Alt 1, Offeror Representations and Certification--Commercial Items; 52.212-2, Evaluation-Commercial Items; 52.212-4, Contract Terms and Conditions--Commercial Items; 52-245-1, Government Property 52.253-1, Computer Generated Forms; 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders--Commercial Items. These clauses apply: 52.203-6, 52.204-10, 52.209-6, 52.209-9, 52.209-10, 52.219-4, 52.219-8, 52.219-28, 52.222-3, 52.222-19, 52.222-21, 52.222-26, 52.222-35, 52.222-36, 52.222-37, 52.222-40, 52.222-54, 52.223-18, 52-225-13, 52.232-33, 52.252-2, 252.204-7008 Export-Controlled Items; 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Executive Orders Applicable to Defense Acquisitions of Commercial Items. These clauses apply: 252.203-7000, Requirements Relating to Compensation of Former DoD Officials; 252.209-7999, Representation by Corporations Regarding an Unpaid Delinquent Tax Liabliity or a Felony Conviction under any Federal Law; 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Exective Orders Applicable to Defense Acquisitions of Commercial Items; 252.225-7012, Preferences for Certain Domestic Commodities; 252.225-7036 with Alternate II, Buy American-Free Trade Agreements-Balance of Payments Program; 252.226-7001, Utilization of Indian Organizations, Indian-Owned Economic Enterprises, and Native Hawaiian Small Business Concerns; 252.227-7015, Technical Data-Commercial Item; 252.232-7003, Electronic Submission of Payment Request and Receiving Reports; 252.232-7006, Wide Area Workflow Payment Instructions; 252.243-7002, Request for Equitable Adjustment. The Defense Priorities and Allocations System (DPAS) rating is C9. To request a copy of the SOW and reference documents email Lucy Boswell at lucy.boswell@dmea.osd.mil. Proposals must be submitted by email to lucy.boswell@dmea.osd.mil and received by 9:00 a.m. Pacific Time, Aug 29 2012.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-12-R-0015/listing.html)
 
Place of Performance
Address: Defense Microelectronic Activity, 4234 54th St, McClellan, California, 95652, United States
Zip Code: 95652
 
Record
SN02839350-W 20120816/120815001211-6a439198dc5b82c372e52b0a9d1a42b2 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

FSG Index  |  This Issue's Index  |  Today's FBO Daily Index Page |
ECGrid: EDI VAN Interconnect ECGridOS: EDI Web Services Interconnect API Government Data Publications CBDDisk Subscribers
 Privacy Policy  Jenny in Wanderland!  © 1994-2024, Loren Data Corp.