SPECIAL NOTICE
A -- Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART)
- Notice Date
- 11/7/2012
- Notice Type
- Special Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 675 North Randolph Street, Arlington, Virginia, 22203-2114, United States
- ZIP Code
- 22203-2114
- Solicitation Number
- DARPA-SN-13-05
- Archive Date
- 12/22/2012
- Point of Contact
- Michael Blackstone,
- E-Mail Address
-
DARPA-SN-13-05@darpa.mil
(DARPA-SN-13-05@darpa.mil)
- Small Business Set-Aside
- N/A
- Description
- DARPA-SN-13-05 Notice of Intent to Award Sole Source Contract For Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) To Teledyne Scientific and Imaging, LLC. The Defense Advanced Research Projects Agency, Contracts Management Officer (CMO), on behalf of the Microsystems Technology Office (MTO), intends to award a sole source contract to Teledyne Scientific and Imaging, LLC (Teledyne), Thousand Oaks, CA for continuation of the Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) program under an 18 month Phase IIIB contract. Previous SMART activities in Phases I, II and IIIA were performed by Teledyne under Contract No. W911QX-06-C-0052. Under the previous contract, 44-GHz transmit sub-arrays were developed in Phase I, transmit and receive functionality was added in Phase II, and a fully functional Q-band transmit array compatible with system implementation through sub-system integration into specific apertures was developed under Phase IIIA. Teledyne has demonstrated a millimeter wave tiled array concept that integrates the required functionality through the invention of an integration process to incorporate silicon digital beam-forming electronics and compound semiconductor Microwave Monolithic Integrated Circuits (MMICs), including Indium Phosphide power amplifiers. These elements were combined into planar antenna technology through the development of a three-dimensional silicon interposer to fabricate small form-factor, wide-scan apertures. The development of the silicon interposer and associated advanced fabrication process flows for the integration of disparate integrated circuits is the fundamental basis of the Teledyne known-good-die packaging approach. The die – including digital integrated circuits, MMICs and other required active and passive components – are tested and known to be fully operational before insertion into the interposer. Owing to the advanced maturity of silicon micro-machining, this approach allows for the interposer to perform as a highly compact package that reliably interconnects the constituent components. The known-good-die implementation developed under SMART involves processes and expertise that are unique to Teledyne and is viewed by the Government as the most viable approach to date for future batch fabrication suitable for large-scale transitions of the technology. Phase III is focused on the successful transition of SMART technology to batch fabrication for an identified DoD application requiring mm-wave functionality and interface-specific requirements and has resulted in unique circuit designs that have been demonstrated and tested to these specifications. Under Phase IIIB, Teledyne will work to create high-yield SMART components at advanced technology readiness levels in full compatibility with system requirements resulting in batch processing capability and supplier of key components. The proposed contract action is for supplies or services for which the Government intends to solicit and negotiate with only one source under authority of FAR 6.302-1 “Only one responsible source and no other supplies or services will satisfy agency requirements”. Teledyne is in a unique position to conduct/complete this research project because this is a continuation of an effort that was competitively selected under DARPA BAA No. 05-27. The same team, resources, and access to in-house laboratories will ensure that the subject SMART project goals and objectives are met. Additionally, as the developer of the technology that is the subject of the SMART Phase IIIB effort, Teledyne possesses unique knowledge, capabilities and proprietary intellectual property/data required to carry out this research effort. This notice of intent is not a request for competitive proposals and no solicitation is currently available. However, interested parties may identify their interest and capability to respond to the requirement. Responses/proposals received within forty-five (45) days after date of publication of this notice will be considered by the Government. Information received will be considered solely for the purpose of determining whether to conduct a competitive procurement. A determination by the Government not to compete this proposed effort on a full and open basis is solely within the discretion of the Government. Interested parties may identify their interest and capability to meet the requirements by submitting a white paper and past performance data by no later than 21 December 2012 to DARPA-SN-13-05@darpa.mil. Questions shall be submitted to the above email address only.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/DARPA-SN-13-05/listing.html)
- Record
- SN02926970-W 20121109/121107235905-bc6d59aaeb8875b5d7a1ca23b937108f (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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