SOLICITATION NOTICE
A -- ICECool Applications (ICECool Apps) - DARPA-BAA-13-21 document
- Notice Date
- 2/6/2013
- Notice Type
- Presolicitation
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 675 North Randolph Street, Arlington, Virginia, 22203-2114, United States
- ZIP Code
- 22203-2114
- Solicitation Number
- DARPA-BAA-13-21
- Archive Date
- 9/23/2013
- Point of Contact
- Dr. Avram Bar-Cohen,
- E-Mail Address
-
DARPA-BAA-13-21@darpa.mil
(DARPA-BAA-13-21@darpa.mil)
- Small Business Set-Aside
- N/A
- Description
- Attachment 2: SF1408 Attachment 1: Proposer Checklist DARPA-BAA-13-21 document ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects. See the full DARPA-BAA-13-21 document attached.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/DARPA-BAA-13-21/listing.html)
- Record
- SN02980610-W 20130208/130206234201-85f9752ac52d0a98f38f6b97d1272b01 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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