SPECIAL NOTICE
99 -- Request for Information (RFI)- Thermally Initiated Venting System (TIVS) Technologies
- Notice Date
- 4/22/2013
- Notice Type
- Special Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- N68936 Naval Air Warfare Center Weapons Division Dept.1 Naval Air Warfare Center Weapons Division Dept.1 429 E. Bowen Rd - Stop 4015 China Lake, CA
- ZIP Code
- 00000
- Solicitation Number
- N6893613R0030
- Archive Date
- 5/23/2014
- E-Mail Address
-
Jessica Rodriguez
(Jessica.r.rodriguez1@navy.mil)
- Small Business Set-Aside
- N/A
- Description
- Request for Information - Thermally Initiated Venting System (TIVS) Technologies Description: 1.This is a special notice open to U.S. industry and academia requesting information on technologies pertaining to Thermally Initiated Venting System (TIVS) technologies. The Sidewinder Program Office of the Naval Air Warfare Center Weapons Division (NAWCWD) is interested in reviewing TIVS technologies, in both the concept and development phases, which will mitigate the reaction violence of both slow cookoff (SCO) and fast cookoff (FCO) of solid rocket motors. The notional initiation requirement for SCO is near 350 °F after duration of exposure pertinent to the SCO environment and for FCO is near 550 °F after duration of exposure pertinent to a FCO environment. This RFI includes both mechanical and electrical TIVS technologies. 2.Objective: Identify TIVS technologies to meet Insensitive Munitions (IM) goals for Type V (burning) reactions in both SCO and FCO without initiating the rocket motor propellant. The major TIVS functions include the thermal sensor, trigger, initiator, transfer energetic and highly reproducible linear shaped charge to score the rocket motor case, but not initiate the contained energetic (explosive or propellant). Features of TIVS technologies that are of particular interest include, but are not limited to: 2.1.Mechanical TIVS devices that have no single point of failure. 2.2.Electronic TIVS devices which are self-powered and tunable for multiple temperatures. 2.3.Technologies that address not only performance and overall packaging concerns, but also affordability. 2.4.TIVS devices that lock-out upon missile acceleration of approximately 10 g ™s, as well as a simple method to reset the device in the field. 2.5.TIVS devices that provide visual indications of a) armed condition, b) initiated condition, c) locked-out condition. 2.6.TIVS thermal sensor/trigger devices less than 1 lbm and a volume less than 1.5 in3. 2.7.TIVS devices that provide a means to be readily replaceable in the field. 3.Background: In order to satisfy IM requirements TIVS devices have been fielded on some missile systems, but are expected to become more prevalent. Future TIVS systems must be in compliance with MIL-STD-1901A. Concepts have to be implemented within volume constraints of missile systems and contain sufficient safety logic to avoid inadvertent failure modes. 4.Information Desired: 4.1.Points of Failure: For safety concerns, no single point of failure mode is acceptable. Information is desired on the failure modes applicable to TIVS technologies and the final state the technology would be in after a failure. 4.2.Electronics TIVS power supply: In electronic TIVS systems, an on-board power supply/thermal battery may be required and must be able to maintain a long shelf life and maintain TIVS operational reliability. Information is desired on the power supply/thermal battery for electronic TIVS technologies. 4.3.High temperature electronic and mechanical components: Information is desired on any electronic components inherent to the TIVS technology and how to mitigate the risk of failure modes at elevated temperatures. Information is also desired on the role of elevated temperature on any mechanical TIVS technology. 4.4.Safety Logic: Information is desired on the safety logic for TIVS technologies including but not limited to lockout at a desired g-limit, lockout to avoid inadvertent aeroheating or bomb-bay thermal conditions, and any visual indication of function lockout. 4.5.Electromagnetic Environmental Effects (E3) and Hazards of Electromagnetic Radiation to Ordnance (HERO): Information is desired on E3 and HERO compliance with respect to TIVS technologies. 4.6.Manufacturing Technologies: Information on technologies that address not only performance but manufacturing affordability for TIVS technologies. 4.7.Packaging Profile and Weight: TIVS devices are generally located on the exterior of the solid rocket motor and/or within the canister. As overall volumetric space is limited on rocket motors, information is requested on technologies that minimize profile and weight. Packaging and weight guidelines pertain to the entire device “ trigger, power, initiator, transfer explosives and output explosive. 4.8.Approved Energetics: Approved materials, as described in Table I of MIL-STD-1316, Table I & II of MIL-STD-1901A, and booster explosives that meet the requirements in AOP-7 should be utilized for TIVS technologies and information is desired for any deviation. Energetics includes initiation, transfer and linear shaped charge energetic. 4.9.Data Rights: Vendor to identify any data rights restrictions or proprietary technologies for each proposed technology. 4.10.Technology Readiness Level (TRL): Vendor to provide an estimate for maturing the technology to TRL-6 for an air-launched tactical missile. 4.11.Other: Information on other methods or technologies that may aid in the risk mitigation associated with SCO and FCO of solid rocket motors are also welcome to be submitted. 5.Please submit information with a cover sheet containing the following information: 5.1.Company Name 5.2.Address 5.3.Name of Technical POC 5.4.Technical POC Phone Number 5.5.Description/Summary of information being submitted including a description of the technology and its applications 5.6.To which category/categories from paragraph 4 does the information pertain? 5.7.What is the Technology Readiness Level (TRL) and/or Manufacturing Readiness Level (MRL) of the technology being presented? 6.White papers are preferred but other forms of information will be accepted. 7.This notice is not to be construed as any type of request for proposal. The Government does not intend to award a contract on the basis of this request or to otherwise pay for the information solicited. Any responses received will not be used as a proposal. 8.Submissions will be considered up to and including SECRET. Companies are to adhere to the National Industrial Security Program Operating Manual (NISPOM) procedures for the transmittal of classified responses. Company responses are to include a name and telephone number of a point of contact having the authority and knowledge to clarify responses with Government representatives. Companies are not limited to a single response. Submissions are due 23 May 2013 and may be made by mailing your response on a compact disc and a hard copy to: Outer Envelope: COMMANDER NAVAIRWARCENWPNDIV 1 ADMINISTRATION CIRCLE China Lake, CA 93555-6100 Inner Envelope: COMMANDER CODE 254130D (Jessica Rodriguez) NAVAIRWARCENWPNDIV 429 E. Bowen Rd. Mail Stop 4015 China Lake, CA 93555-6108
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