SOLICITATION NOTICE
59 -- LTC for Advanced Microcircuit Emulation (AME - Package #1
- Notice Date
- 7/24/2013
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Defense Logistics Agency, DLA Acquisition Locations, DLA Land and Maritime - BSM, P O Box 3990, Columbus, Ohio, 43216-5000, United States
- ZIP Code
- 43216-5000
- Solicitation Number
- SPM7MX12R0033
- Archive Date
- 9/10/2013
- Point of Contact
- Karl J. Hinch, Phone: 6146927954
- E-Mail Address
-
Karl.Hinch@dla.mil
(Karl.Hinch@dla.mil)
- Small Business Set-Aside
- N/A
- Description
- Proposal Information Package (PIP) ADVANCED MICROCIRCUIT EMULATION (AME) ENRICHMENT PROGRAM Broad Agency Announcement (BAA). The Defense Logistics Agency is soliciting proposals for its Advanced Microcircuit Emulation (AME) Enrichment Program. Offerors are required to download and follow all instructions and procedures in this solicitation's accompanying Proposal Information Package (PIP). The goal of the AME Enrichment Program is developing advanced military quality (e.g. MIL-PRF-38535, MIL-PRF-38534, etc.), economical, rapid, turn-key integrated Emulation technology/process(es) and capability that are proven through hard Form, Fit, and Function (FFF) device/assembly demonstrations and LRIP (Low Rate Initial Production) FFF Emulations in the major interest categories (application areas). The AME Enrichment Program must also maintain access to the technologies and devices developed under the predecessor AME, AME Validation, and AME Implementation Programs. The Government desires the lowest possible resource commitment to maintain the successful AME technology commencing at the earliest possible point (no later than LRIP). Concepts must address self-sufficiency and should evidence a realistic early transition capability to a self-sufficient mode of operation. This BAA focuses on the development, demonstration, and implementation of non-traditional methods of production and supply of non-procurable microcircuits and circuit card assemblies. It is expected the AME Enrichment Program will be the basis to develop and implement the capability to economically supply needs of DLA and the Services for currently non-procurable in-scope items and those becoming non-procurable for the next five to seven years. This acquisition is also the vehicle to implement capability developed and/or fielded in the AME Implementation Program. The goal of the AME Program is to reduce the number of items classed non-procurable and supply these previously non-procurable items at an attractive cost, thereby increasing warfighter support. The existing DLA-funded digital Emulation production capability is discussed in the PIP. The existing DLA-funded Low Rate Initial Production capability may be described as Large Scale Integration up through Application Specific Integrated Circuits of approximately 500,000 gates (feature sizes down to 0.5 micron CMOS and up to 5 levels of metallization). There is also a 100-volt output, 5-volt logic driver capability. There is no technology transfer funding (or schedule time) available to transfer and/or prove any of these technologies with/to non-ready infrastructure. The Government is willing to consider some, none, or all concepts that develop, implement, and demonstrate the following capabilities: •1) Advanced Digital Devices - This application area includes digital devices beyond current capability. The desired capability may be broadly bounded by Large Scale Integration up through high-end devices. •2) Microprocessors and Microcontrollers - This application area includes both early standard and custom microprocessors (≥8bit) up through mid-term microprocessors (16bit, 32bit and larger). •3) Memory - This application area includes the broad RAM and ROM categories beyond the existing capabilities. •4) Programmable Logic Devices - This category includes Emulation of devices spanning the various types of both standard programmable and field programmable devices. •5) Hybrid Microcircuits - This application area includes hybrid microcircuits employing components from Small Scale Integration up to the scale and complexity of the die in the accompanying application areas above. •6) Linear/Analog Devices - This application area includes devices starting with the low-end high performance operational amplifiers and continuing through advanced high performance analog-to-digital (A/D) and digital-to-analog (D/A) convertors. •7) Circuit Card Assemblies - This application includes engineering services related to replacement of electronic assemblies or elements thereof with Emulated FFF devices. The following are common desirable elements for concepts in meeting all of the above applications: •1) Concepts whose principal elements have maximum applicability/compatibility across multi-application areas. •2) Concepts building on existing and/or state-of-the art processes and techniques are desirable. •3) Concepts that include comprehensive outreach to the DoD community (commercial and organic) are required. •4) Concepts that include the offeror seeking and achieving AME technology insertions into Weapons Systems are necessary. Further details on individual topics are available in this BAA's PIP. Proposals for individual efforts should not exceed five years in length. The PIP provides further information on areas of interest, the submission, evaluation, funding processes, proposal abstract format and proposal format. This announcement will be open for 30 days from the date of publication. Proposal abstracts are mandatory and the Government's decision after review of the abstract on whether to submit a full proposal is final and binding. Proposal abstracts shall be submitted within 10 days of this solicitation. This proposal abstract procedure is intended to minimize unnecessary effort in the proposal preparation and review. The Government will attempt to review proposal abstracts within ten (10) working days after receipt of a proposal abstract and will make a binding decision as to whether an offeror may submit a full formal proposal. Proposal abstracts will be reviewed as they are received. Early submissions are strongly encouraged. The due date for receipt of full proposals is 30 days after the date of publication of this announcement. This announcement in conjunction with the PIP constitutes the total BAA. No Request For Proposal or formal solicitation will be issued. Proposals will not be evaluated against each other since they are not submitted in accordance with a common work statement. Evaluation of proposals will be accomplished through a scientific review of each proposal using the criteria stipulated in the PIP. All administrative correspondence and questions related to this announcement must be directed to the administrative contact below. Proposal abstracts may not be submitted by fax. Contract awards are expected in the 3rd quarter of FY 13. Total funding for AME is anticipated to be approximately $62,422,000.00 over five years. The Administrative Address for this BAA is: DLA Land and Maritime, Maritime Supply Chain, Attn: DSCC-ZCB (Karl Hinch), PO Box 3990, Columbus, OH 43218-3990. Phone (614) 692-7954. E-mail: Karl.Hinch@dla.mil
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DLA/J3/DSCC-BSM/SPM7MX12R0033/listing.html)
- Place of Performance
- Address: PO Box 3990, Columbus, Ohio, 43218, United States
- Zip Code: 43218
- Zip Code: 43218
- Record
- SN03126487-W 20130726/130725000012-8f25715467c9d2bd963b42a82c0817a8 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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