AWARD
59 -- ELECTRONIC COMPONENT ASSEMBLY
- Notice Date
- 1/8/2018
- Notice Type
- Award Notice
- NAICS
- 334418
— Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Contracting Office
- Defense Logistics Agency, DLA Acquisition Locations, DLA Land and Maritime - BSM, P O Box 3990, Columbus, Ohio, 43216-5000, United States
- ZIP Code
- 43216-5000
- Solicitation Number
- SPE7LX17R0060
- Archive Date
- 1/23/2018
- Point of Contact
- Matthew Stein,
- E-Mail Address
-
matthew.stein@dla.mil
(matthew.stein@dla.mil)
- Small Business Set-Aside
- N/A
- Award Number
- SPE7LX18D0006
- Award Date
- 1/8/2018
- Awardee
- HERLEY INDUSTRIES, INC, 3061 INDUSTRY DR, LANCASTER, Pennsylvania 17603-4025, United States
- Award Amount
- $538,458.75 (1 Year Only with First Article Testing Waived)
- Line Number
- 0001
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DLA/J3/DSCC-BSM/Awards/SPE7LX18D0006.html)
- Record
- SN04783510-W 20180110/180108231058-cd581f98f6ee3734882ebef2f0a90208 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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