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FBO DAILY - FEDBIZOPPS ISSUE OF OCTOBER 26, 2018 FBO #6181
MODIFICATION

Y -- Industry Day for MIT Lincoln Laboratory

Notice Date
10/24/2018
 
Notice Type
Modification/Amendment
 
NAICS
236220 — Commercial and Institutional Building Construction
 
Contracting Office
Department of the Army, U.S. Army Corps of Engineers, USACE District, New England, 696 Virginia Road, Concord, Massachusetts, 01742-2751, United States
 
ZIP Code
01742-2751
 
Solicitation Number
W912WJ19X0001
 
Archive Date
11/24/2018
 
Point of Contact
Alysha MacDonald, Phone: 9783188715
 
E-Mail Address
Alysha.MacDonald@usace.army.mil
(Alysha.MacDonald@usace.army.mil)
 
Small Business Set-Aside
N/A
 
Description
Description: The U.S. Army Corps of Engineers (USACE) New England District will host an Industry Day for the MIT Lincoln Laboratory - Compound Semiconductor Lab/Microsystem Integration Facility (CSL/MIF) project. A construction contract is anticipated to be awarded in Fiscal Year 2019. The purpose of this Industry Day is to improve industry's understanding of USACE's requirements, answer questions on the CSL/MIF project, and gain an understanding of how industry can support this construction. The event will be held at a location TBD, on December 12th, 2018 from 10:00am to 3:00pm. Check-in for the event will begin at 9:30am. Topics to be included in this presentation will include MIT LL Mission, Project Overview, Current Design, Draft Solicitation, Industry Networking, and a Q&A session. Contractors interested in participating shall register by submitting your company name and the names of no more than three individuals who will attend no later than November 9, 2018. Registration is free and required for all attendees/participants. Please register via the link below: https://www.eventbrite.com/e/mit-ll-cslmif-industry-day-registration-50854250432 Overview: MIT LL is a federally funded research and development center chartered to apply advanced technology to problems of national security. The project scope of work described herein involves the construction of a new Compound Semiconductor Laboratory and Microelectronics Integration Facility on the MIT LL campus, which is located at Hanscom Air Force Base (HAFB), Lexington, Massachusetts. The Compound Semiconductor Laboratory and Microelectronics Integration Facility (CSL-MIF) consists of approximately 162,000 gross square feet (GSF) of new laboratory and office space which includes a Clean Room complex for use by the Advanced Technologies Division of MIT LL. The intent of the CSL is to consolidate MIT LL's existing compound semiconductor materials growth, fabrication and characterization facilities. The intent of the MIF is to consolidate and enhance MIT LL's facilities for the fabrication and packaging of specialized advanced electronic prototypes.. The CSL-MIF is anticipated to be three stories, and constructed using concrete foundations, a steel and reinforced concrete superstructure, and energy efficient building systems, envelope, and roofing. The new building will be connected to other MIT LL buildings via a pedestrian connector bridge as part of this project. Specialized construction requirements include large and sophisticated clean rooms for microprocessor development and experimentation (the total clean room area under filter is approximately 35,000 net square feet, designed to Federal Standard (FED STD) 209E Class 10/International Organization for Standardization (ISO) Class 4 standards); associated complex HVAC and electrical requirements; secure communications areas; hazardous, toxic, and corrosive process liquid and gas storage, transport, distribution and associated waste collection systems; and a structural foundation system that minimizes vibrations and noise in the clean room areas. The facility will be constructed to meet Institute of Environmental Sciences and Technology (IEST) standards for vibration control (VC) to VC-C/D with select portions to VC-E. Required support process utilities include the following: Equipment Cooling Water (ECW), Clean Dry Air (CDA), three (3) grades of gaseous nitrogen (N2), Liquid Nitrogen (LN2), Process Vacuum (PVAC), Ultra-Pure Water - semiconductor grade (UPW), 120/208/480V single-phase and three-phase power with UPS, liquid waste treatment (pH adjustment), and abatement of hazardous exhaust streams. The CSL-MIF is to be located on an existing paved parking lot that contains a cluster of trees in the center and is surrounded by other structures and as such is considered a constrained site. The site slopes from south to north with a change in grade of approximately 28 feet. Site improvements will include demolition of five (5) buildings, expansion of the main chiller plant, providing a new feed from the main electrical distribution plant, access roads, replacement parking, relocation of existing utilities and new utility connections, landscaping, and all other work necessary to make this a complete and usable project. Building demolition and replacement parking will be completed under a separate contract. Facilities will be designed as permanent construction in accordance with the DoD Unified Facilities Criteria (UFC) 1-200-01, General Building Requirements, DoD antiterrorism/force protection requirements per UFC 4-010-01, sustainability principles in accordance UFC 1-200-02, and High Performance and Sustainable Building Requirements. Note that installation of laboratory-owned equipment and high-value tool sets will be completed by others. This project is on a secure DoD facility and involves sensitive information; all members of the contractor's team who work on this project must be US citizens and will be subject to a background check. After the event the presentations, attendee list, Q&As, and any other information exchanged will be posted on FedBizOps (FBO) within ten working days.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/USA/COE/DACA33/W912WJ19X0001/listing.html)
 
Place of Performance
Address: MIT Lincoln Laboratory, Hanscom Air Force Base, Lexington, Massachusetts, United States
 
Record
SN05133779-W 20181026/181024230755-86325351213bc464d78a7d8eca661d72 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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