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FBO DAILY - FEDBIZOPPS ISSUE OF NOVEMBER 18, 2018 FBO #6204
SOLICITATION NOTICE

36 -- High Force Flip Chip Bonder

Notice Date

11/16/2018
 

Notice Type

Synopsis
 

NAICS

333242 — Semiconductor Machinery Manufacturing
 

Contracting Office

NASA/Goddard Space Flight Center, Code 210.M Greenbelt MD 20771
 

ZIP Code

20771
 

Solicitation Number

80GSFC19P0005
 

Response Due

12/2/2018
 

Point of Contact

Patrick DeWyngaert, Contracting Officer, Phone 3012867183
 

E-Mail Address

patrick.b.dewyngaert@nasa.gov
 

Small Business Set-Aside

N/A
 

Description

National Aeronautics and Space Administration (NASA), Goddard Space Flight Center (GSFC) Code 210.M, Office of Mission Enabling in support of Code 553, The Detector Systems Branch intends to negotiate solely with SETNA, 343 Meadow Fox Lane, Chester, NH, 03036, to procure a High Force Flip Chip Bonder in accordance with 10 U.S.C. 2304(c)(1), as implemented by Federal Acquisition Regulation (FAR) 6.302-1, "Only one responsible source and no other supplies or services will satisfy agency requirements" to provide the SETNA High Force Flip Chip Bonder. The Chip Bonder will provide new capabilities for improved performance of products manufactured in the Detector Development Laboratory and in particular, the equipment is needed to realize future missions. The system is used to mate detector arrays, components or similar devices to readout electronics or other focal plane components. The system should be suitable for bonding small parts with low force as well as larger focal plane arrays requiring high force between 1 to 4000 Newtons. The system shall include all necessary software and hardware to enable precision alignment, force control and temperature control. The vendor shall provide technical support of the equipment. NASA/GSFC currently builds state of the art detector systems, some of which require a flip-chip bonding process to accurately align, to sub-micron tolerances, and bond, two components together. Future detector systems will require the same alignment tolerances and planarity, but will require larger bond forces due to a trending increase in the footprint of focal plane arrays. The vendor SETNA has been identified as being capable of delivering a tool capable of 4000 N of force while maintaining a bonding accuracy of 0.5um, and fulfills all of the government requirements. With the research conducted, that includes contacting several vendors directly, it has been determined that SETNA is the only vendor that is capable of meeting these stated requirements, most importantly being force, as well as alignment accuracy and planarity, to enable future large focal plane devices. NASA/GSFC intend to issue a sole-source Request for Proposal (RFP) to SETNA. The estimated period of performance for this firm fixed price (FFP) contract will be for ten (10) months. Organizations who believe they can provide these services without any detrimental impact to the program schedule supported by this work should fully identify their interest and capabilities within 15 days after publication of this synopsis. All responsible sources may submit an offer which shall be considered by the agency. Oral communications are not acceptable in response to this notice. The notice of intent and any documents related to this procurement will be available over the Internet. These documents will reside on a World Wide Web (WWW) server, which may be accessed using a WWW browser application. It is the offeror's responsibility to monitor the Internet site for the release of amendments (if any). Potential offerors will be responsible for downloading their own copy of amendments, if any. The Government intends to acquire a commercial item using FAR Part 12. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html. The North American Industry Classification System (NAICS) for this requirement is 333242; Small Business Size: 1,500. This announcement constitutes the notice required by FAR 5.201. All questions and responses concerning this notice shall be emailed to Patrick DeWyngaert at patrick.b.dewyngaert@nasa.gov. Interested parties must submit their capabilities and qualifications to perform the effort in writing to the above e-mail address no later than 5 PM EST, December 2, 2018. Information received will be considered solely for the purpose of determining whether a competitive procurement is in the best interest of the Government. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the Government. Contracting Office Address: NASA/GSFC ATTN: POC: Patrick DeWyngaert, 210.3 Procurement Operations Division 8800 Greenbelt Road, Greenbelt, MD 20771 NOTE: THIS NOTICE WAS NOT POSTED TO FEDBIZOPPS ON THE DATE INDICATED IN THE NOTICE ITSELF (16-NOV-2018); HOWEVER, IT DID APPEAR IN THE FEDBIZOPPS FTP FEED ON THIS DATE. PLEASE CONTACT 877-472-3779 or fbo.support@gsa.gov REGARDING THIS ISSUE.
 

Web Link

Link To Document
(https://www.fbo.gov/notices/c68bcd773607451bd7b6da2a4b37063d)
 

Place of Performance

Address: 343 Meadow Fox Lane Chester, NH

Zip Code: 03036

Country: US
 

Record

SN05153522-F 20181118/181116230009 (fbodaily.com)
 

Source

FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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