SPECIAL NOTICE
99 -- TECHNOLOGY TRANSFER OPPORTUNITY: Dust Tolerant Quick Disconnect With Self-Sealing Barrier (KSC-TOPS-64)
- Notice Date
- 1/16/2020 9:00:45 AM
- Notice Type
- Special Notice
- NAICS
- 927110
— Space Research and Technology
- Contracting Office
- NATIONAL AERONAUTICS AND SPACE ADMINISTRATION US
- ZIP Code
- 00000
- Solicitation Number
- T2P-KSC-00027
- Response Due
- 1/15/2021 2:00:00 PM
- Archive Date
- 01/30/2021
- Point of Contact
- Kurt Kessel, Technology Transfer Specialist
- E-Mail Address
-
kurt.r.kessel@nasa.gov
(kurt.r.kessel@nasa.gov)
- Description
- NASA�s Technology Transfer Program solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology.� License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use.��NASA provides no funding in conjunction with these potential licenses. THE TECHNOLOGY: NASA Kennedy Space Center seeks partners interested in the commercial application of the Dust Tolerant Quick Disconnect with Self-Sealing Barrier.� NASA's Kennedy Space Center (KSC) is offering companies licensing and partnering opportunities for the development and commercialization of this innovative technology.� Designed at KSC, this technology is intended for use in dusty environments where dust particles can contaminate connectors resulting in wear on connector surfaces and unreliable connections.� The Quick Disconnect (QD) employs columnar arrays of parallel filaments on both sides of a connector to remove dust from the connector surfaces prior to mating. Dusty, dirty environments can be very tough on connectors.� The abrasive nature of dust and dirt particles can rub and wear down connector surfaces through friction, and have a negative effect on coatings used on gaskets to seal equipment.� Dust on umbilical connections can also make mating and de-mating electrical and fluid connections difficult, hazardous, and unreliable.� NASA's Quick Disconnect (QD) design consists of columnar arrays of parallel filaments.� All the pins of the electrical connector easily penetrate the barriers when the umbilicals are brought together.� They are wiped clean of dust when they penetrate the barrier and mate cleanly and reliably.� Likewise, the male end of a fluid connector penetrates the filament arrays of both connector ends.� Since the filament arrays are oriented perpendicular to each other, the entire circumference of the connector is contacted by the filaments that stretch around, conform to, and sweep off dust from the mating surface ensuring a clean and secure connection. To express interest in this opportunity, please submit a license application through NASA�s Automated Technology Licensing Application System (ATLAS) by visiting https://technology.nasa.gov/patent/KSC-TOPS-64 If you have any questions, please contact Kurt Kessel, Technology Transfer Specialist, Kennedy Space Center at kurt.r.kessel@nasa.gov with the title of this Technology Transfer Opportunity as listed in this FBO notice and your preferred contact information.� For more information about licensing other NASA-developed technologies, please visit the NASA Technology Transfer Portal at https://technology.nasa.gov/ These responses are provided to members of NASA�s Technology Transfer Program for the purpose of promoting public awareness of NASA-developed technology products, and conducting preliminary market research to determine public interest in and potential for future licensing opportunities.��No follow-on procurement is expected to result from responses to this Notice.
- Web Link
-
SAM.gov Permalink
(https://beta.sam.gov/opp/06afcb71568c4121b78face1106e9270/view)
- Record
- SN05536610-F 20200118/200116230137 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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