MODIFICATION
66 -- Automated High Placement Accuracy Flip-Chip Die Bonder
- Notice Date
- 8/14/2024 8:22:56 AM
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
- ZIP Code
- 20899
- Solicitation Number
- 1333ND24QNB030528
- Response Due
- 8/28/2024 9:00:00 AM
- Archive Date
- 09/12/2024
- Point of Contact
- Sadaf Afkhami, Phone: 3019753976
- E-Mail Address
-
Sadaf.Afkhami@nist.gov
(Sadaf.Afkhami@nist.gov)
- Small Business Set-Aside
- SBA Total Small Business Set-Aside (FAR 19.5)
- Description
- DESCRIPTION: THIS IS A COMBINED SYNOPSIS/SOLICITATION FOR COMMERCIAL PRODUCTS OR COMMERCIAL SERVICES PREPARED IN ACCORDANCE WITH THE FORMAT IN FAR SUBPART 12.6-STREAMLINED PROCEDURES FOR EVALUATION AND SOLICITATION FOR COMMERCIAL ITEMS-AS SUPPLEMENTED WITH ADDITIONAL INFORMATION INCLUDED IN THIS NOTICE. THIS ANNOUNCEMENT CONSTITUTES THE ONLY SOLICITATION; QUOTATIONS ARE BEING REQUESTED, AND A SEPARATE WRITTEN SOLICITATION WILL NOT BE ISSUED. THE SOLICITATION IS BEING ISSUED USING SIMPLIFIED ACQUISITION PROCEDURES UNDER THE AUTHORITY OF FAR PART 13.5 SIMPLIFIED PROCEDURES FOR CERTAIN COMMERCIAL ITEMS. This solicitation is a Request for Quotation (RFQ). The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular (FAC) 2024-05 dated May 22, 2024.� The associated North American Industrial Classification System (NAICS) code for this procurement is 334413� Semiconductor and Related Device Manufacturing with a small business size standard of 1,250 employees. This acquisition is being solicited as a total small business set-aside. Contractors must possess an ACTIVE registration in the System for Award Management system, www.SAM.gov, when submitting a quotation and shall continue to be registered until time of award, during performance, and through final payment of any contract resulting from this solicitation. The Contracting Officer will confirm that quoters have an �active� registration at the www.sam.gov website upon receipt of the quotation. If the SAM.gov registration is not active, the quotation will not be considered for award. BACKGROUND: The Microsystems and Nanotechnology Division (MND) within the National Institute of Standards and Technology�s (NIST) Physical Measurement Lab (PML) develops integrated microsystems by advancing the state of the art in nanofabrication, thereby enabling the transfer of NIST measurement technologies to the industrial, academic, and government communities. In conjunction with the Quantum Measurement, Quantum Sensors and Nanoscale Device Characterization within the PML, the MND is developing methods to better understand, characterize, and predict the strength of directly bonded dielectric, semiconductor and metallic plasma-treated wafer surfaces that are relevant for current industrial electronic and photonic device fabrication processes. To achieve this goal, a wide range of analytical and metrological techniques will be applied to pre- and post-bond surface-treated wafer pairs and correlated with results from bond strength measurements. New standardized methods for characterizing chip-to-chip bond strength tests will, in addition, be developed. The investigation will cover parings of various semiconductor, dielectric and metallic surfaces, and is expected to require, for each surface pair combination, a wide range of parameter variations. To support this investigation, an automated flip-chip die bonder is required for performing die-do-die and die-to-wafer bonding in the Center for Nanoscale Science and Technology cleanroom in Gaithersburg, MD. The objective of this solicitation is to establish a Firm-Fixed-Price purchase order based on the specifications described in the attached Statement of Requirements (SOR). **Please see attachments for complete details regarding this combined synopsis/solicitation.**�
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/a484aa8881bf4a2da51acbd1e6e14174/view)
- Place of Performance
- Address: Gaithersburg, MD 20899, USA
- Zip Code: 20899
- Country: USA
- Zip Code: 20899
- Record
- SN07169541-F 20240816/240814230109 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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