SOLICITATION NOTICE
A -- ROCWafers
- Notice Date
- 8/14/2024 9:15:43 AM
- Notice Type
- Solicitation
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- SLAC Natl Accel Lab -DOE Contractor Menlo Park CA 94025 USA
- ZIP Code
- 94025
- Solicitation Number
- SLAC_347034_ROCWafers
- Response Due
- 8/29/2024 5:00:00 PM
- Archive Date
- 09/13/2024
- Point of Contact
- Katherine Jill A. Coh, Phone: 6509262770
- E-Mail Address
-
kcoh@slac.stanford.edu
(kcoh@slac.stanford.edu)
- Description
- SLAC National Accelerator Laboratory is operated by Stanford University for the Department of Energy.� As a management and operating contractor, subcontracts awarded by the Laboratory are not Federal procurements, and are not directly subject to the Federal Acquisition Regulations in 48 CFR. Nonetheless, certain Federal laws, Executive Orders, and regulations may affect our DOE approved purchasing system, as required by statute, regulation, or contract terms and conditions. Required item(s) listed below: 1.) 9 inch mask plates for 200-mm Read-Out-Chip (ROC) wafers 200mm (8inch)� = Qty 1 NOTE: SLAC will supply the following: (see attached GFP document) 8 sensor wafers 4 ROC wafers Layout of sensor wafer Layout of ROC chip Stepper information for ROC wafer Technical criteria as follows: Read-Out-Chip (ROC) wafers 200mm (8 inch) ROC wafer 700 microns thick ROC chips are about 2 cm by 2 cm in area each Sensor wafers 150mm ( 6 inch) diameter Sensor wafers 500 microns thick bump pitch is 50 microns x 50 microns Multiple ROC chips bonded to a single larger sensor chip as below Statement of work: Vendor will order the mask plates. Vendor will perform lithography and deposit under-bump-metallization on the sensor wafers Vendor will inspect the sensor wafers after formation of the under-bump-metallization stack Vendor will dice the sensor wafers Vendor will perform lithography and deposit the under-bump metallization and solder bumps on the ROC wafers. Vendor will inspect the ROC wafers following the solder bump formation Vendor will dice the ROC wafers into chips of several sizes.� Vendor will flip-chip bond 40 multi-ROCs to sensor chip modules as follows: 8 � �x � � � 4x1 ( 4 ROC / sensor) 24 �x � � �2x2 ( 4 ROC / sensor) 8 � �x � � �2x4 ( 8 ROC / sensor) Vendor will�return all unused parts.� Vendor must has experience performing flip-chip bonding and solder bump formation at fifty micron pitch.� Quote is for product only; no on-site services permitted. Source selection will be based on Lowest Priced Technically Acceptable method. Please provide a price and lead time quotation by COB August 29, 2024. Send quote to kcoh@SLAC.stanford.edu. Please be advised that the requirement was also posted in SAM.gov. Is there any room for additional discount such as for Academic, ICPT, GSA, or Government Institutions? Buy American Act Certification (BAA) applies to awards over $10,000. Representations & Certifications Rider is required. Once completed the Reps and Certs is valid for one year until renewal. If you have already completed one within the year please disregard. Otherwise, please complete and return. All subcontractors are required to register in the System for Award Management (www.sam.gov). If possible, please provide a link to your webpage for published price list to substantiate for the prices quoted. The resulting purchase order will be issued on a fixed price basis. SLAC National Accelerator Laboratory Terms and Conditions for Fixed Price Commercial Supplies and Services (Rev. August 2023) will be made a part of the resulting order. Please mark up terms and conditions if you wish to negotiate. No mark ups mean that you accept SLAC Terms and Conditions. Payment Terms will be NET-30 Freight terms will be FOB Destination Prepaid and Add You are requested to mark and identify proprietary/confidential information provided in response to the solicitation. Contact me directly with any questions. Sincerely, Katherine Jill A. Coh Procurement Commodities Team Lead SLAC National Accelerator Laboratory 2575 Sand Hill Road Menlo Park, CA 94025 Phone: 650-926-2770
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/d453255bbea4408ab81468d555ac6efc/view)
- Place of Performance
- Address: Menlo Park, CA 94025, USA
- Zip Code: 94025
- Country: USA
- Zip Code: 94025
- Record
- SN07169662-F 20240816/240814230110 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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