AWARD
59 -- BACKPLANE ASSEMBLY
- Notice Date
- 1/15/2025 1:06:51 PM
- Notice Type
- Award Notice
- NAICS
- 334412
— Bare Printed Circuit Board Manufacturing
- Contracting Office
- DLA LAND AND MARITIME COLUMBUS OH 43218-3990 USA
- ZIP Code
- 43218-3990
- Solicitation Number
- SPE7M025T2776
- Archive Date
- 01/30/2025
- Point of Contact
- Jennifer Chavez614-692-8590
- E-Mail Address
-
Jennifer.Chavez@dla.mil
(Jennifer.Chavez@dla.mil)
- Award Number
- SPE7M025V2737
- Award Date
- 01/15/2025
- Awardee
- DISAN ENGINEERING CORP
- Award Amount
- 210600.00
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/9088d918436d422fb6033701786f3e0c/view)
- Record
- SN07313187-F 20250117/250115230057 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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