SPECIAL NOTICE
A -- J&A - Direct Bonding
- Notice Date
- 5/27/2026 11:09:30 AM
- Notice Type
- Justification
- Contracting Office
- W6QK ACC-APG ABERDEEN PROVING GROU MD 21005-1846 USA
- ZIP Code
- 21005-1846
- Solicitation Number
- W56KGU26CA004
- Archive Date
- 06/26/2026
- Point of Contact
- Hanh Dinh
- E-Mail Address
-
hanh.t.dinh.civ@army.mil
(hanh.t.dinh.civ@army.mil)
- Award Number
- W56KGU26CA004
- Award Date
- 05/18/2026
- Description
- Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.
- Web Link
-
SAM.gov Permalink
(https://sam.gov/workspace/contract/opp/35631225f1fb4b6185ea6fc0633a99d5/view)
- Place of Performance
- Address: Fort Belvoir, VA, USA
- Country: USA
- Country: USA
- Record
- SN07829961-F 20260529/260527230044 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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