Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF JULY 1,1997 PSA#1878

U.S. Environmental Protection Agency, 26 W. Martin Luther King Dr., Cincinnati, OH 45268

A -- SOILING OF BUILDING MATERIAL FROM EXPOSURE TO PARTICULATE MATTER SOL 97-00492 DUE 070997 POC Hans Schellhas (513) 366-2055 WEB: NA, NA. E-MAIL: U.S. EPA -- Cincinnati Contracts Management Division, schellhas.hans@epamail.epa.gov. The U.S. Environmental Protection Agency (EPA) is conducting a "market search" for a contractor to conduct a research study to evaluate particulate matter (PM) exposure-related soiling of commonly used building materials. The required research shall include a feasibility study to identify the most appropriate analytical technique and procedures for characterizing PM deposition (soiling) to different material surfaces. The contractor should possess High Resolution Field Emission and Variable Pressure Scanning Electron Microscopy and Computerized Surface Image Analysis capabilities. The feasibility study should be designed to characterize the effects of particle size (PM1.0, PM2.5, and PM10), composition, deposition, and concentration on the soiling of commonly used building materials. The study design should include: 1. Identification of exposure sites for an extensive field evaluation. Analyses should be conducted at two exposure sites, one representing a site with low ambient concentrations ofPM and one site with a history of exceeding the National Ambient Air Quality Standard for PM. 2. Identification of the types of building materials to be exposed. 3. Identification of appropriate analytical procedures and techniques through limited short term exposure. All interested parties should submit appropriate documentation to the office identified above that demonstrates their capabilities within TWELVE (12) DAYS OF THIS NOTICE. THIS IS NOT A REQUEST FOR QUOTES. No Telephonic messages will be honored. Facsimile responses can be sent to Hans Schellhas at (513) 366-2107. Responses via Email will also be honored. (0177)

Loren Data Corp. http://www.ld.com (SYN# 0020 19970701\A-0020.SOL)


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