Naval Air Warfare Center Training Systems Division, Code 27, 12350 Research Parkway, Orlando, Fl 32826-3224

A -- HARDENED SUBMINIATURE TELEMETRY SENSOR SYSTEM (HSTSS) CUSTOMIZABLE MULTI-CHIP MODULE (MCM) SUBSTRATES -- POTENTIAL SOURCES SOUGHT DUE 092598 POC Cathy Desrosiers, Contract Specialist, (407)380-4019 E-MAIL: Click here to contact Cathy Desrosiers, Contract Specialist,, Cathy_Desrosiers@stricom.army.mil. The U.S. Army Simulation, Training and Instrumentation Command (STRICOM), in conjunction with the Yuma Proving Grounds and the Army Research Laboratory, is seeking information from industry regarding the availability of mature and emerging electronic packaging technologies for the U.S Army's HSTSS Program. A technology is being sought which offers the greatest design flexibility in packaging prototype high-g instrumentation systems. HSTSS will be designed to be micro miniature instrumentation that must survive the harsh environment of gun-launched munition systems. The packaging technologies will be required to accept die level components and withstand up to 100k g's. The packaging technology (after being populated) will be integrated into the host test articles (not to exceed a diameter of 0.75 inch and a height of 0.2 inch) and not interfere with their static and dynamic performance characteristics. The packaging technology must allow for fast turnaround of prototypes. The Army currently has on-going activities to develop subminiature L and S-Band transmitters, data acquisition and encoder circuits, battery technologies, and sensors suitable for high-g/high spin environments. Information is desired specifically on customizable MCM substrates that can provide rapid prototyping of high-density electronic packages. The technology needs to provide for the following: 1. Customizability: Through a customization or programming process, internal net wiring shall be performed on at least two layers; 2. At least four planes shall be provided in the base substrate; 3. Must be geometrically flexible: The substrates need to be easily shaped or sized to fit unique spaces and cavities; 4. Allow for the direct attachment of bare die integrated circuits, as well as discrete surface mount technology components such as capacitors and resistors. Flip chip devices shall also be supported; 5. The substrate shall accommodate mixed signal technology with operational frequencies up to 1 GHz; and 6. Support software, such as layout/routing tool, shall also be provided. Information and/or comments, whether supportive or critical, are solicited. The Government does not intend to pay for the information solicited and will not recognize any costs associated with submission of information. Proprietary information is not being solicited; however, if it is submitted it should be marked accordingly. Responses to this synopsis shall answer the following questions: 1. Does your company have a technology which meets the basic requirements stated above? If so, please provide detailed description and product literature. 2. In low quantities (i.e., less than 100) compare the cost of your customizable substrate to that of a typical MCM-D substrate. 3. Does your company have high-g test data for this product? 4. Compare your technology to that of standard MCM-C, D, and L processes. Address the following: development time (i.e., time from layout to fully tested bare substrate), cost, electrical performance, and packaging density. 5. Describe the technical risk and problem areas of your technology as it relates to the high-g/high-spin environment. 6. Describe any near term advancements for your technology. 7. Describe any development programs your company has been involved in, within the last three years, related to this technology. 8. Describe how and what length of time you support your products. 9. What is the size status of your company in relation to the SIC code stated below? The information contained in this notice is for planning purposes only and does not constitute a request for proposal. The Government reserves the right to offer the requirement to the 8(a) program or to set the requirement aside for small business. The SIC Code for this program is 3674, and the associated size standard is 500 employees. The Government plans to use the submitted information in finalizing the acquisition strategy for the HSTSS Program. Those interested should respond by submitting information and answers to the questions contained herein, in writing, to Mrs. Cathy Desrosiers, Contract Specialist, at the above address by 25 September 1998. Posted 09/09/98 (W-SN247406). (0252)

Loren Data Corp. http://www.ld.com (SYN# 0008 19980911\A-0008.SOL)