MODELING AND SIMULATION Sandia National Laboratories possesses the most extensive modeling and simulation capabilities found anywhere in the world. These capabilities have been applied in the technology of polymers and other organic materials to meet the critical needs of Federal customers and a diverse clientele of U. S. industries. Important applications include: prediction of materials properties to guide the choice of molecular structures for laboratory synthesis guiding the optimization of materials properties, component designs, and manufacturing processes prediction of effective service life and failure modes. Starting at the molecular level, Sandia's simulation modeling capabilities have been utilized to model polymeric materials with desired properties using massively parallel computers as a way to minimize expensive and time consuming laboratory experiments, while at the same time developing more accurate understanding of cause-and-effect relationships between chemical structure and final properties. PRISM modeling capabilities have been employed to design new polymer alloys and blends from the knowledge gained at the molecular level. These specific modeling and simulation capabilities are called: Molecular Simulation of Polymeric Materials Computer Modeling of Polymeric Materials Sandia has specific experience in applying their powerful and unique modeling capabilities in organic sciences and polymer technology in the pursuit of understanding and developing materials used in electronic components. Specific materials applications include thermoset and particle-reinforced polymers, and electronic packaging and flip chip underfill. These process modeling capabilities utilize proprietary code and use the same massively parallel computers found only at Sandia. Sandia has extended their modeling capabilities to develop understanding of the dynamics of underfill flow as well as adhesion properties. These specific modeling and aging/reliability capabilities are called: Modeling and Predicting Stresses in Thermoset Materials Modeling Particle Reinforced Polymers Flip Chip Underfill Studies Adhesion Studies Each of these proprietary Sandia capabilities may be applied separately or in combination to solve challenging problems in the field of polymer and other organic sciences. Sandia has the flexibility to form specific teams of technical experts from any or all of the above capabilities to focus expertise on specific technical challenges. We are interested in making this modeling technology available to companies responsive to partnering with Sandia to develop near/term and/or future applications via licensing or cooperative development agreements. For further information, please respond by mail or fax to Joanne Trujillo no later than December 3, 1998 at: Sandia National Laboratories, MS 1380, P. O. Box 5800, Albuquerque, New Mexico 87185-1380. Fax: (505) 843-4163. Please indicate the date and title of this CBD notice. E-MAIL: Joanne Trujillo, jmtruji@sandia.gov. Posted 11/19/98 (W-SN273114).

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