Commander, U.S. Army Aviation and Missile Command, Acquisition Center, Research Development and Engineering Center, Redstone Arsenal, AL 35898-5000

A -- DEVELOPMENT OF PLASTIC ENCAPSULATED MICROCIRCUIT (PEM) COATING PROCESSES FOR MILITARY APPLICATION SOL DAAH01-99-R-RB01 DUE 052799 POC Deidra Barnes, Contract Specialist, (256) 876-3139, or Harold Smith, Contracting Officer, (256) 876-0908 This modification removes the requirement for 1:1 cost share. Cost share is still a requirement for this solicitation, and cost share approaching or exceeding 1:1 is encouraged. Paragraph #5 in the Requirements section and Item #2 in the COST portion of the Criteria section have been modified to reflect this change to the BAA. Paragraph 5 under REQUIREMENTS has been to changed to read as follows: 5. Cost Sharing is mandatory for this effort. The proposal shall contain sufficient detail to determine amount of cost sharing. Information on allowable in-kind cost sharing can be found in OMB circular A-110 and DoD 3210.6-R, "DoD Grant and Agreement Regulations". Although not admissible as cost sharing, leveraging of existing related federal programs is encouraged. Item 2 in the COST portion under CRITERIA has been changed to read as follows: Amount of cost sharing; cost sharing equal or greater than to 1:1 is encouraged. Cost sharing will be evaluated using the guidelines found in OMB Circular A-110 and DoD 3210.6-R, "DoD Grant and Agreement Regulations". All other information remains unchanged. Posted 05/12/99 (W-SN330805). (0132)

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