Defense Advanced Research Projects Agency (DARPA), Contract Management Directorate (CMD), 3701 N. Fairfax Dr., Arlington, VA 22203-1714

A -- HETEROGENEOUS INTEGRATION OF MATERIALS WITH SILICON SOL BAA99-39 DUE 120299 POC D. Radack, DARPA/MTO, fax (703) 351-8616 Defense Advanced Research Projects Agency (DARPA), Contracts Management Directorate (CMD), 3701 North Fairfax Drive, Arlington, VA 22203-1714. HETEROGENEOUS INTEGRATION OF MATERIALS WITH SILICON, SOL BAA99-39 DUE DATE 120299, POC D. RADACK, DARPA/MTO, FAX (703) 351-8616. PROGRAM OBJECTIVES AND DESCRIPTION: The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative research proposals in the area of heterogeneous integration of advanced materials and device technologies with silicon. The goals of this program are to enable fabrication of new classes of chip-scale microsystems with the highest electrical functionality and capability, through the development and exploitation of new and innovative integration technologies that provide seamless intimate incorporation of complex materials and high performance devices with silicon, while maintaining compatibility with silicon fabrication process technology. The objectives are to pursue the development of those heterogeneous integration technologies that enable a semiconductor die to have overall performance and capabilities that greatly exceed what would be available with currently available integration technologies such as multi-chip modules. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice. DARPA seeks innovative proposals in the following areas: (1) Technologies for Heterogeneous Integration; and (2) Demonstrations of Unique Applications for Heterogeneously Integrated Microsystems. Additional information on these technology areas is provided in the Areas of Interest section of the BAA99-39 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Awards totaling approximately $20 million over three years are expected to be made during the first half of calendar year 2000. Multiple awards are anticipated. Collaborative efforts/teaming and cost sharing are encouraged. The technical POC for this effort is Dr. Daniel J. Radack, fax: (703) 696-2206 electronic mail: dradack@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled "BAA99-39, Heterogeneous Integration of Materials With Silicon, Proposer Information Pamphlet" which provides further information on the areas of interest, the submission, evaluation, and funding processes, proposal formats, and other general information. This pamphlet may be obtained from the World Wide Web (WWW) or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. Proposers must submit an original and eight (8) copies of the proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA99-39) on or before 4:00 p.m., local time, December 2, 1999, in order to be considered. This notice, in conjunction with the BAA99-39 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in heterogeneous integration of materials with silicon. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA99-39. Proposals may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA: Evaluation of proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit; (2) potential contribution and relevance to the DARPA mission; (3) quality of program plans and their structure and plans for technology transition; (4) offeror's capabilities and related experience; and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 351-8616 (Addressed to: DARPA/MTO, BAA99-39). Electronic Mail: BAA99-39@darpa.mil. Mail: DARPA/MTO, ATTN: BAA99-39, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area. Posted 09/28/99 (W-SN385326). (0271)

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