A -- HIGH-ACCURACY DIE BONDER SYSTEM

Notice Date

September 10, 2001

Contracting Office

US Army Aviation and Missile Command DAAH01, ATTN: AMSAM-AC, Building 5303, Martin Road, Redstone Arsenal, AL 35898-5280

ZIP Code

35898-5280

Solicitation Number

PAN R20221

Response Due

September 24, 2001

Point of Contact

Beverly Wills, 256-876-8761

E-Mail Address

US Army Aviation and Missile Command DAAH01 (beverly.wills@redstone.army.mil)

Description

The Army Aviation and Missile Command proposes to procure one (1) High-Accuracy Die Bonder System that includes the following: (1) Appropriate motion, pressure, temperature, and environment control for the stages and sample (both die and substrate) holder s to perform thermo-compression and solder reflow bonding maintaining alignment of die to substrate to within 1.0 micrometers, along the lateral axes, after the bonding process is complete. The die to be bonded will generally be a few square millimeters ( that is between one and three millimeters) in area while the substrate will generally measure 40 or 50 millimeters along the longest dimension. (2) Capability to align die to substrate to tolerances substantially less than one micrometer, along the latera l axes, in order that post-bond alignment accuracy remains better than one micrometer. (3) Capability to coplanarize die and substrate, in the pitch and yaw axes, to within 1.0 degrees. (4) Capability to rotationally align die and substrate, in the theta axis, to within 1.0 degrees. (5) Heating capability for both the sample (both die and substrate) holders. (6) Capability to align using alignment marks placed on the bottom side of the die and the top side of the substrate with the optional assistance o f automated pattern recognition. (7) Capability to align using alignment marks placed on the top side of the die and the top side of the substrate with the optional assistance of automated pattern recognition. (8) Capability to align using alignment mark s placed on both the top and bottom side of the die and the top side of the substrate with the optional assistance of automated pattern recognition. This capability should include a mechanism to measure the offset between the alignment marks on the top si de and those on the bottom side of the die and use that offset measurement to ensure proper alignment just before bonding by viewing down onto alignment marks on the top side of both the die and the substrate. (9) At lease one electrically insulated sampl e holder to allow isolated electrical connection to the die or substrate. (10) At least 17mm height allowance for substrate thickness and possible substrate cooler option. (11) Delivery, installation, initial on-site operator training, and testing of sys tem on government premises. (12) Operator and maintenance manuals for the system. This procurement is restricted to RD Automation, 121 Ethel Road West, Piscataway, NJ 08854. The proposed contract action is for supplies or services for which the Governme nt intends to solicit and negotiate with only one source under the authority of FAR 6.302 based on extensive market research for this commercial item. Interested persons may identify their interest and capability to respond to the requirement or submit pro posals. This notice of intent is not a request for competitive proposals. However, all proposals received within seven (7) days after date of publication of this synopsis will be considered by the Government. A determination by the Government not to compet e with this proposed contract based upon responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement.

Web Link

Army Single Face to Industry (http://acquisition.army.mil)

Record

Loren Data Corp. 20010912/ASOL016.HTM (D-253 SN50X2E8)