J -- J -- CY 2002 CHARGE COUPLED DEVICE (CCD) WAFER BOARD DEVELOPMENT

Notice Date

September 13, 2001

Contracting Office

US Army Aviation and Missile Command DAAH23, ATTN: AMSAM-AC, Building 5303, Martin Road, Redstone Arsenal, AL 35898-5280

ZIP Code

35898-5280

Solicitation Number

DAAH23-99-G-0013

Response Due

September 28, 2001

Point of Contact

Sandra Self, (256) 313-4053

E-Mail Address

US Army Aviation and Missile Command DAAH23 (sandra.self@peoavn.redstone.army.mil)

Description

The Government proposes to acquire, on an other than full and open competitive basis, a Charge Coupled Device (CCD) Wafer Board Development. This effort is to retool and re-fabricate the CCD Sensor Assembly to replace a 4 wafer with a 6 wafer in the CC D Camera, in support of the legacy and the Modernized TADS/PNVS programs. The period of performance is a twelve (12) month contract, from date of award. It is anticipated that award will be made utilizing a Firm Fixed Price contract. This is a sole sour ce requirement to Lockheed Martin Electronics and Missiles, 5600 Sand Lake Road, MP-228, Orlando, Florida 32819-8907. No telephone request will be accepted. Firms that can accomplish the above requirement are encouraged to identify themselves in writing to the Contracting Officer. This requirement is under the authority and justification of 10 U.S.C. 2304)(1) based on the determination that the Government needs can only be satisfied by one source. All responsible sources may submit an offer which shall be considered by the agency. See Note 22.

Web Link

Army Single Face to Industry (http://acquisition.army.mil)

Record

Loren Data Corp. 20010917/JSOL002.HTM (D-256 SN50X5H6)